Description
Solder paste 100g Active flux that facilitates soldering of the following elements: copper, silver-plated, zinc-coated and nickelplated, used in the places where rosin is not sufficient Application: soldering copper silver zinc and nickel plated components PLEASE NOTE - PICTURE IT MAY BE USED FROM SMALLER OR BIGGER TIN- BUT THE CONTENTS REMIAN SAME Solder paste acc. to DIN EN 29454-1 1.1.2.C is a medium activity flux in the form of a paste, based on rosin and organic halogen activator, for easy soldering of copper, silver, zinc and nickel items. It is used in lead-tinning and soldering in the radio and telecommunication technology as well as in installation of electrical equipment. Post-soldering flux residues do not cause corrosion of non-ferrous metals and may remain on the joints. (it is advisable to wash them with alcohol remover). The product is used where rosin is not enough.
